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Nihon Superior opens new office in Indonesia
Tuesday, 09 February 2010

Nihon Superior Co. Ltd. announces that its subsidiary Nihon Superior (Singapore) Pte. Ltd. is opening a representative office in Indonesia on February 8, 2010.

 
New high performance PCB conformal coating is a UV cure adhesive
Tuesday, 09 February 2010

Master Bond’s UV curing conformal coating is designed to restrain the impact of moisture, dust, chemicals, and temperature extremes on electronic circuitry and components.

 
Seika Machinery introduces solder paste recycling unit
Monday, 08 February 2010

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, has introduced a Solder Paste Recycling Unit.

 
Multitest’s InCarrier provides reliability and best cost of test
Monday, 08 February 2010

Multitest received the first multi-system order for the new InCarrier™ handler by a European IDM. The systems will be used for high-parallel test of small MEMS sensors.

 
Elcoteq participates in the Electronics Next India 2010
Friday, 05 February 2010

Elcoteq SE will introduce its electronics manufacturing services at Electronics Next India 2010 show, being held February 24-26, 2010, at Pragati Maidan, New Delhi.

 
Seika’s manufacturer awarded Prime Minister’s Green Campaign Award
Thursday, 04 February 2010

Seika Machinery was nominated as one of the recipients of the 2009 Green Campaign Award of the office of the Japanese Prime Minister.

 
Elcoteq becomes Inmarsat's manufacturing and Life Cycle Services partner
Thursday, 04 February 2010

Elcoteq SE has been selected as the global manufacturing and Life Cycle Services partner for Inmarsat, the leading provider of global mobile satellite communications services.

 
Major new trade show for Brazil is introduced
Thursday, 04 February 2010

Trafalgar Publications Ltd. announces Global Electronics Manufacturing Expo Brazil 2010, which will be held at the prestigious, state-of-the-art Expo Center Norte in São Paulo, Brazil on October 5-7, 2010.

 
DEK and Maxim SMT Technologies showcase latest innovations at Electronics Next 2010
Thursday, 04 February 2010

DEK is preparing to showcase a comprehensive range of advanced technologies and processes at this year’s Electronics Next exhibition along with the company’s agent Maxim SMT in New Delhi.

 
Vi TECHNOLOGY gets Frost & Sullivan 2009 Award
Wednesday, 03 February 2010

Vi TECHNOLOGY is rewarded by Frost & Sullivan for its consistent focus on providing value to customers in the AOI equipment market.

 
KIC to showcase technologies that reduce reflow oven electricity use at Electronics Next India 2010
Monday, 01 February 2010

At Electronics Next India 2010 in New Delhi, KIC will showcase technologies in Hall No. 6 that have proven to reduce electricity use in reflow ovens by up to 15 percent.

 
SMT prototype production on high quality level
Monday, 01 February 2010

Essemtec will exhibit highly flexible SMT production equipment at the upcoming Electronics Next India 2010 in New Delhi.

 
Interview - Rajeev Chawla, Sr. Vice President, IMAGES Exhibitions
Friday, 29 January 2010

"With the Indian opportunity being a reality, ELECTRONICS NEXT INDIA show has been recognised by the industry and trade as the most critical trade platform for the Indian opportunity", said Rajeev Chawla, Sr. Vice President, IMAGES Exhibitions in a conversation with Debasish P. Choudhury, Regional Editor, Global SMT & Packaging India.

 
Inc. Magazine ranks MIRTEC Corp. as one of the fastest growing companies in 2009
Friday, 29 January 2010

MIRTEC Corp. announces that Inc. Magazine has recognized MIRTEC’s North American Sales and Service Division, MIRTEC Corp., as one of the fastest-growing companies in its third annual Inc. 5000 company ranking.

 
ELECTRONICS NEXT INDIA thumps the City
Thursday, 28 January 2010

An evident reverberation in the electronics manufacturing industry will be noticed when South Asia's premiere exhibition - ELECTRONICS NEXT INDIA 2010 will instigate its edition in the city of New Delhi on 24 February, 2010.

 
Essemtec introduces simultaneous through-hole LEDs and SMD placement
Wednesday, 27 January 2010

Essemtec introduces the CLM979 Radial Component Feeder that enables the assembly of through-hole LEDs on a standard pick-and-place machine.

 
Milara and Mirae combine forces A powerful combination for the electronics manufacturing industry
Wednesday, 27 January 2010

Milara Inc., a leading vendor of fully and semiautomatic stencil printers for SMT and wafer applications, announces a partnership agreement with Mirae Corporation of Korea.

 
Defence sector in India, cache of opportunities: CII-KPMG Study
Sunday, 24 January 2010

India is currently the 10th largest defence spender in the world India's defence spending has grown manifold since the country announced its first defence budget in 1950, to INR 1,450 Bn in 2009-10.

 
TT electronics Malaysia facility awarded ISO13485 medical manufacturing certification
Friday, 22 January 2010

TT electronics announced today that its manufacturing facility in Kuantan, Malaysia manufacturing facility has received ISO 13485:2003 medical certification.

 
Manncorp.com launches new turnkey section - showcasing 7 complete SMT Assembly Systems
Tuesday, 19 January 2010

Manncorp has introduced seven new electronic assembly turnkey lines with throughput rates ranging from prototyping to 10,500 cph.

 
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Featured Interview

Interview-Terry Heilman, Sunstone Circuits

Trevor Galbraith spoke to president and CEO Terry Heilman about what makes Sunstone different from your average board shop.

 

Featured Agent

Bergen Group - Rajinder Kumar interview

India's local market for PV installation will reach 8GW by the end of 2012.

 

Global Business

Year end assessment: the path to recovery

2009 will certainly be remembered as a very difficult year for the global electronics industry. Fortunately even the most conservative most prognosticators now see at least a subdued "recovery" in 2010.

 

Industry Blogs

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